Highcon Systems Ltd, the world’s pioneer in digital die cutting and creasing systems for folding carton and corrugated packaging and display, will present the transformative potential of its digital die cutting solutions at Packaging Innovations 2025. Visitors will see real customer jobs produced using Highcon systems, offering insights into practical applications and benefits. The event will take place on February 12-13 at the NEC in Birmingham, where Highcon will be located at Stand V86. 

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