[Highcon in Highcon] DS Smith Leads Packaging Innovation with Installation of First Highcon Beam 3

Yavne, Israel, 17 June 2024 Highcon Systems Ltd (TASE: HICN), today announced that DS Smith, one of the largest paperboard packaging companies in the world, will be the first company in the world to install the groundbreaking Highcon Beam 3 digital die cutting system. This announcement was made following the Drupa 2024 trade fair, held in Düsseldorf, Germany, where the Highcon Beam 3 premiered for the first time.

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