[Highcon in Hybrid Software] Highcon and Hybrid Software Collaborate to Enhance Digital Die Cutting Workflow Efficiency
Gent, Belgium and Yavne, Israel 19. November 2024 – Highcon and Hybrid Software announce a partnership to elevate the digital die cutting workflow for packaging and display converters by integrating Hybrid’s renowned PACKZ software, offering full PDF support, into Highcon’s Digital Die Cutting Workflow Package (DWP). This partnership aims to deliver more streamlined processes, increased precision, and enhanced workflow integration, empowering operators across production sites. Read...
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