As AI workloads push the boundaries of data center infrastructure, cooling has emerged as one of the most critical challenges. High-density racks, filled with power-hungry GPUs, generate far more heat than traditional computing racks and air cooling is no longer sufficient. Today, most high-performance AI servers and racks use cold plates as part of a Direct Liquid Cooling (DLC) system. However, traditional cold plate-based single-phase cooling systems cannot accommodate the escalating power densities of next-generation accelerators.

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